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Surface Defect Detection System Aura O RLGЕ.442272.501

Surface Defect Detection System Aura O RLGЕ.442272.501

Brand: Aura-O
$42,000 - $150,000 USD
MOQ: 1 pieces

Key Features

Size of substrates to be processed: 150 mm
Minimum size of controlled particles: On sapphire - 300 nm.
Plate thickness: 0.752 mm
Maximum capacity for 100 mm diameter plates, not less than: 15 kcal/h

Description

The installation for control of introduced defectivity RLGE.442272.501 (commercial name "Aura O") is designed for detection of defects on the wafer surface, determination of their positions in reference to the coordinate system and estimation of the size of each defect, which allows to detect problems related to the technological process and eliminate defects affecting the volume of production faster. The unit is used to inspect polished wafers of semiconductor materials such as silicon, germanium and gallium arsenide, as well as polished sapphire wafers. It allows high-quality surface analysis and detection of the smallest defects, which is important for high performance and reliability of semiconductor devices and other electronic components.

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