Multi-layer Server Motherboard "Butterfly 2

Multi-layer Server Motherboard "Butterfly 2

Brand: Butterfly

$1,200 - $6,000 USD

MOQ: 1 pieces

Key Features

Maximum RAM capacity: Up to 8192GB (using 32 256GB RAM modules)

Number of DIMM slots on the board: 32 µGy

DC/AC mains power supply: DC 12.2 V ± 0.4 V from busbar Rack / connectors for 2 220 V AC power supplies

Testing interface: DB9 COM

Supplier Information

DELTA SOLUTIONS LLC

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Description

Multilayer printed circuit board, which is the basis of a server device, acts as a link between the components of the server and provides joint operation of: microprocessors, RAM, and other components of the server device.

Specifications

Maximum RAM capacity

Up to 8192GB (using 32 256GB RAM modules)

Number of DIMM slots on the board

32 µGy

DC/AC mains power supply

DC 12.2 V ± 0.4 V from busbar Rack / connectors for 2 220 V AC power supplies

Testing interface

DB9 COM

Number of USB connectors on the front panel

USB 3.0 - 2 pcs.

Video interface

VGA (mini VGA *)

Platform management interface

IPMI via LAN RJ45

PCIe Gen4 connector type

2x Riser (1U x16) 2x OCP3.0 (x16) (SFF-TA-1002) 4C+ 6x EDSFF (x8) (SFF-TA-1009) 4x U.2 SFF (x4) (SFF-8639)

Number of PCIe connectors

2x M.2 PCIe Gen3x2 80 mm/110 mm sizes

Number of SATA connectors

12x SATA 6Gb/s via mini-SAS HD

Type of RAM

RDIMM/LRDIMM

Length

437 mm

Width

508 mm

Net weight

3 m² living area

Number of DIMM slots per memory channel

2

Power supply capacity

2000 cm³

RAM bus frequency

3200/2933 MHz

Thermal Design Power (TDP) of the microprocessor

up to 270 W (each)

Chipset

Lewisburg-R PCH (C621A)

Interface connection of microprocessors

Intel® Ultra Path Interconnect (UPI) with operating speeds up to 11.2GT/s (3 UPIs per CPU)

Microprocessor family

Intel® Ice Lake (ICX-SP) XCC

Microprocessor (CPU) connector

Two P 4 sockets, LGA 4189

Number of RAM channels per microprocessor

8

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