High-Power Excimer Laser DC 4000 — OPTOSISTEMY LLC

Name: High-Power Excimer Laser DC 4000
Brand: OptoSystems
SKU: 22350
Availability: InStock

Brand: OptoSystems

$90,000 - $300,000 USD

MOQ: 1 pieces

Supplier Information

OPTOSISTEMY LLC

🇷🇺 📦 🏭 🛡️

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Description

The DC 4000 is a high-repetition-rate industrial excimer laser developed by Optosystems, a Russian photonics company headquartered in Troitsk, Moscow and specializing in UV and IR laser systems for industry and scientific research. Purpose-built for demanding microelectronics manufacturing environments, the DC 4000 fires up to 4,000 pulses per second and is offered in two deep-UV wavelengths: 248 nm (KrF) delivering 30 mJ per pulse and 120 W of average power, and 193 nm (ArF) with 15 mJ per pulse and 60 W average power.

Pulse duration is 7–9 ns, and shot-to-shot energy stability is held below 2% sigma — a specification critical for uniform dose delivery in lithographic exposure. The asymmetric output beam measures 14 × 2.5 mm with divergence of 3.5 × 1 mrad, designed to couple efficiently into cylindrical homogenizer and slit-optics assemblies standard in projection lithography tools.

Water cooling sustains continuous operation at full power, and the system is powered from a conventional industrial 220/380 V, 50 Hz supply consuming less than 20 kVA. At 960 kg and 1890 × 810 × 1840 mm, the DC 4000 integrates into dedicated cleanroom lithography cells, FBG inscription stations, and high-throughput UV material-processing lines.

Details & Equipment

Product Views

Main View

The DC 4000 in its standard industrial enclosure. The compact cabinet houses the gas discharge chamber, high-voltage modulator, vacuum subsystem, and water-cooling circuit within a 1890 × 810 × 1840 mm footprint.

Three-Quarter View

A three-quarter perspective showing the overall build quality and panel layout. The 960 kg stainless-and-steel structure is designed for vibration-isolated placement on an optical table or cleanroom floor.

Front Panel

The front panel provides the primary beam exit port and operator interface, including status indicators and the UV output aperture aligned for direct connection to beam-delivery optics.

Rear Panel

The rear panel carries water-cooling inlet/outlet fittings, gas connections for halogen and buffer gas supply, and the main electrical interface accepting 220/380 V at up to 20 kVA.

Side Profiles

Side View 1

Left-side profile illustrating the cabinet depth and access panels for internal maintenance of the discharge module and vacuum pump assembly.

Side View 2

Right-side profile showing the symmetric enclosure design; service access is provided from both sides to facilitate in-situ gas halide replenishment and optics exchange.

Features

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4,000 Hz Repetition Rate

The DC 4000 fires up to 4,000 pulses per second, maximizing throughput in step-and-repeat exposure tools and high-speed UV ablation systems.

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Dual Deep-UV Wavelengths

Available at 248 nm (KrF, 30 mJ / 120 W) or 193 nm (ArF, 15 mJ / 60 W), covering both standard semiconductor lithography wavelengths from a single platform.

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< 2% Sigma Energy Stability

Pulse-to-pulse energy stability better than 2% sigma ensures repeatable dose delivery across every exposure, reducing defects and improving process yield.

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Asymmetric Beam Profile

The 14 × 2.5 mm output beam with 3.5 × 1 mrad divergence matches standard illumination-optics apertures, reducing the complexity of downstream beam conditioning.

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Water-Cooled Continuous Operation

Integrated water cooling sustains stable output at up to 120 W average power without duty-cycle restrictions, supporting 24/7 production environments.

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Standard Industrial Power Interface

Accepts 220/380 V at 50 Hz and consumes under 20 kVA, compatible with industrial electrical infrastructure and requiring no special power conditioning.

Buyer Benefits

120 W average UV power at 248 nm enables high-dose-rate lithography and rapid material ablation without compromising stability
Shot-to-shot energy stability below 2% sigma minimizes per-exposure dose errors, directly improving lithographic and ablation yields
193 nm wavelength option provides the shorter UV wavelength needed for sub-micron feature patterning
4,000 Hz operation maximizes wafer throughput in both step-and-repeat and maskless direct-write exposure systems
Asymmetric 14 × 2.5 mm beam couples directly into slit-optics and cylindrical homogenizer assemblies standard in projection tools
7–9 ns pulse duration limits heat-affected zones during ablation, preserving substrate integrity around processed features
Single-vendor supply of laser, power supplies, and service from Optosystems reduces integration risk and simplifies ongoing support

Applications

Maskless direct-write lithography for MEMS, microfluidics, and advanced photomask fabrication Projection (mask-based) lithography in semiconductor device and micro-component manufacturing lines Fiber Bragg grating (FBG) inscription using phase-mask or interferometric exposure setups Precision UV ablation and micro-structuring of polymers, dielectrics, and thin-film stacks Pulsed laser deposition (PLD) of oxide, nitride, and composite thin-film coatings Laser annealing of amorphous silicon layers for flat-panel display backplane processing Photochemical surface functionalization and UV curing in electronics assembly workflows Scientific research in deep-UV photophysics, photochemistry, and short-pulse laser–matter interaction

Source: official manufacturer website