Purpose - Prototyping, design
Layer formation technology - DLP/LCP/SLA
Working material - Photopolymer resin
Minimum layer thickness - 0,020 mm
Maximum layer thickness - 0.3 mm
Building speed - 10-15 mm/h
Dimensions of working space - 120x68x129 mm
Interfaces - RJ45
Ability to work on non-native programmes - Yes
Supported file formats - STL, OBJ, AMF
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