Vacuum deposition unit UVN-74P-3M-1

Vacuum spraying unit UVN-74P-3M-1, designed for
double-sided deposition of metallic films of copper or aluminium with a chromium sublayer on
polycor and satin substrates by thermal vacuum sputtering in the production of hybrid-film microfibres.
production of hybrid-film microchips.
Maximum number of substrates with the size of
60x48x(0,5...1,0) mm 40 pcs.
Chromium adhesion layer sputtering is carried out with the help of resistive
evaporator to control the set resistance of the layer on the witness.
Sputtering of other layers is carried out with the help of two electronic
evaporators with a ring cathode according to the set time.
The time to reach a residual pressure of 4 x 10-4 Pa in the working chamber
after opening of the high-vacuum shutter is not more than 80 min.
The unit provides:
-regulation of the rotation speed of the drum with
substrates in the range from 10 to 60 rpm;
-heating of the drum up to 300 °C;
-control of resistance
of film sputtering on substrates in the range from 0 to 25 kOhm;
-...