Vacuum deposition unit UVN-74P-3M-3

The vacuum sputtering unit UVN-74P-3M-3 is designed for double-sided deposition of multilayer metal films on polycor and sitalloy substrates by thermal and magnetron vacuum sputtering methods in the production of hybrid-film microcircuits. Maximum number of substrates of 60x48x(0,5...1,0) mm size 40 pcs. to be processed simultaneously. Sputtering of the adhesion layer is carried out with the help of a resistive evaporator according to the control of the set resistance of the layer on the witness. Sputtering of other layers is carried out with the help of two magnetron evaporators according to the set time. The electrical supply of the magnetrons is unipolar. The time to reach the residual pressure of 4 x 10-4 Pa in the working chamber after opening of the high-vacuum gate is not more than 80 min The unit provides: -regulation of the rotation speed of the drum with substrates in the range from 10 to 60 rpm; -heating of the drum up to 300 °C; -control of resistance of the witness of film sputtering on the substrates in the range from 0 to 25...