Vacuum spraying machine "Oratoria 5-1"

Installation of vacuum spraying "Oratory 5-1", is designed for the application of
by magnetron sputtering thin films of aluminium doped with silicon,
on silicon wafers with a diameter of 76 or 100 mm in the production of semiconductor devices and integrated circuits.
devices and integrated circuits.
The vacuum chamber of the unit has four silicon wafer processing positions,
fixed in three wafer holders of the hemispherical removable cassette:
- position 1 - pre-cleaning of wafers in the airlock;
- position 2 - wafer heating and degassing;
- Clause 3 - first one-sided magnetron sputtering of the film on the wafers;
- position 4 - second one-sided magnetron sputtering of the film on the plates.
In all four positions, a 2-step planetary motion of the silicon wafers is ensured by the rotation of the
of the silicon wafers by rotating the hemispherical cassette about its centre axis and rotating the substrate.
centre axis and rotation of the wafer holders.
The installation provides a sequential circular step-by-step transfer of the cassette with the
wafers from position to position for...