Purpose:
Realisation of 180 - 90 nm level technologies.
Features:
The cluster is designed for realisation of basic technological processes (BTP) in production of a wide range of electronic component base (ECB) at the enterprises of radio-electronic industry. The cluster consists of process modules and a robotic vacuum-transport system for automated movement of wafers with a diameter of 150,200 mm between process modules with loading/unloading of wafers from cassettes or SMIF-containers.
Any of the eight technological (process) modules of the plants can be docked to the cluster complex, such as:
Magna TM 200-01K,
Magna TM 200-04K,
Plasma TM 200-01K,
Plasma TM 200-02K,
Plasma TM 200-03K,
Plasma TM 200-04K,
Isofaz TM 200-01K,
Isofaz TM 200-02K,
BTO TM 200-01K.
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