Vacuum spraying machine Oratoria 29M

Vacuum spraying unit "Oratoria 29M", designed for application of
metal films of aluminium, titanium, nickel, molybdenum on silicon wafers for microelectronics with diameter 76 mm.
microelectronics with a diameter of 76 mm and 100 mm.
The unit provides:
-automatic pumping of the working chamber, airlock chamber
wafer loading chamber, wafer sluice chamber, wafer unloading chamber and gas inlet into them;
-automatic loading of wafers on the conveyor from the cassette
and unloading of wafers into the cassette;
-capacity of not less than 100 wafers per hour without taking into account the time of
pumping time of sluice chambers;
-time to reach residual pressure of 1.33 x 10-2 Pa in the working chamber
from the moment of opening of the high-vacuum gate not more than 30 min;
-regulation of conveyor speed in the range
from 120 to 400 mm/min;
-regulation of halogen lamp current
KG 220-2000-2 plate heating in the range from 3 to 6 A;
-regulation of argon pressure in the deposition zone
in the range from 0.4 to 1.3 Pa;
-operation of three magnetrons in the range of power
each from 0.5 to 6.0 kW;
-regulation ...