Installation for control of introduced defectiveness RLGE.442272.501 (Commercial name "Aura O")

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FOB, CIF & EXW terms available

Key Highlights

  • Made in Russia - engineered for durability
  • Suitable for challenging environments
  • Lower cost of ownership than European alternatives
  • Bulk orders available with volume discounts
  • Documentation and customs clearance assistance provided

Description

The installation for control of introduced defectivity RLGE.442272.501 (commercial name "Aura O") is designed for detection of defects on the wafer surface, determination of their positions in reference to the coordinate system and estimation of the size of each defect, which allows to detect problems related to the technological process and eliminate defects affecting the volume of production faster. The unit is used to inspect polished wafers of semiconductor materials such as silicon, germanium and gallium arsenide, as well as polished sapphire wafers. It allows high-quality surface analysis and detection of the smallest defects, which is important for high performance and reliability of semiconductor devices and other electronic components.

Specifications

Type of product according to PP RF 616 Other tools and instruments for measurement, inspection and testing
Size of substrates to be processed 150 mm
Plate thickness 0.752 mm
Maximum capacity for 100 mm diameter plates, not less than 15
Minimum size of controlled particles On sapphire - 300 nm.
Probability of detecting a defect of minimum size 95 %
Power supply 220 V 10%, 50/60Hz, (3 AC, N, PE)
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Delivery & Payment

Shipping Terms

FOB Novorossiysk, Russia CIF Available to major ports worldwide EXW Manufacturer's facility, Russia

Delivery Time

Sea freight: 30-60 days (depending on destination) Air freight: 14-21 days (for urgent orders)

Payment Methods

Letter of Credit (L/C) Wire Transfer (T/T) Escrow Services

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