Thermal imaging module "Module-TPV-640-GEN2"

The thermal imaging modules based on uncooled microbolometer arrays are multispectral surveillance systems. Thermal imaging and multispectral (heat+tele) systems are used in thermal audit, non-destructive testing of technical objects, medical diagnostics, in fire and rescue services, security systems and other areas with the need for observation in night and day conditions without additional illumination and in the presence of interference (fog, smoke). The peculiarity of thermal imaging systems produced by IEOS LLC under its own trade mark and in the presence of FIPS patents (for invention and computer programme) is the construction of a computing unit based on digital signal processors (DSP), which allows, in addition to the basic functions of image processing, to build in additional functions at the customer's request.