Manufacture of multilayer and double-sided printed circuit boards

"Single-sided (thickness 0,2-3,0 mm), double-sided (thickness 0,2-3,0 mm), multilayer (up to 26 layers, thickness 0,4-3,0 mm), prefabricated multilayer, double-sided for microwave, through hole metallisation, direct metallisation. Realised characteristics:
a) minimum dimensions: conductor/gap - 0.1/0.1 mm,
b) minimum diameter of metallised holes - 0,10 mm,
c) minimum guarantee belt - 0,025 mm,
d) ratio of hole diameter/board thickness - 1:10,
e) finishing coatings: galvanic and chemical gold, HAL (PIC-63), galvanic nickel plating, local galvanic gilding of the circuit, protective solder mask - liquid two-component composition ELPEMER GL2467 by PETERS.
Manufacturing control: automated optical control, electrical control, impedance control.
Printed circuit board production technology includes:
1. automated design.
2. High-precision drilling and milling equipment.
3. Digital photolithography (patternless tech...