
Butterfly 2 server motherboard
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FOB, CIF & EXW terms available
Key Highlights
- Made in Russia - engineered for durability
- Suitable for challenging environments
- Lower cost of ownership than European alternatives
- Bulk orders available with volume discounts
- Documentation and customs clearance assistance provided
Description
Multilayer printed circuit board, which is the basis of a server device, acts as a link between the components of the server and provides joint operation of: microprocessors, RAM, and other components of the server device.
Specifications
DC/AC mains power supply
DC 12.2 V ± 0.4 V from busbar Rack / connectors for 2 220 V AC power supplies
Testing interface
DB9 COM
Number of USB connectors on the front panel
USB 3.0 - 2 pcs.
Video interface
VGA (mini VGA *)
Platform management interface
IPMI via LAN RJ45
PCIe Gen4 connector type
2x Riser (1U x16) 2x OCP3.0 (x16) (SFF-TA-1002) 4C+ 6x EDSFF (x8) (SFF-TA-1009) 4x U.2 SFF (x4) (SFF-8639)
Number of PCIe connectors
2x M.2 PCIe Gen3x2 80 mm/110 mm sizes
Number of SATA connectors
12x SATA 6Gb/s via mini-SAS HD
Maximum RAM capacity
Up to 8192GB (using 32 256GB RAM modules)
Type of RAM
RDIMM/LRDIMM
Length
437 mm
Width
508 mm
Net weight
3 kg
Number of DIMM slots per memory channel
2
Power supply capacity
2000 W
RAM bus frequency
3200/2933 MHz
Thermal Design Power (TDP) of the microprocessor
up to 270 W (each)
Chipset
Lewisburg-R PCH (C621A)
Interface connection of microprocessors
Intel® Ultra Path Interconnect (UPI) with operating speeds up to 11.2GT/s (3 UPIs per CPU)
Microprocessor family
Intel® Ice Lake (ICX-SP) XCC
Microprocessor (CPU) connector
Two P 4 sockets, LGA 4189
Number of DIMM slots on the board
32 pc
Number of RAM channels per microprocessor
8
Note: All specifications are provided by the manufacturer and may be subject to change. Please contact us to confirm the latest specifications before placing your order.
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Shipping Terms
Delivery Time
Sea freight: 30-60 days (depending on destination)
Air freight: 14-21 days (for urgent orders)
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