Purpose:
Non-destructive quality control of welded, soldered joints of REA components of product categories:
- BGA-cases and integrated circuits
- semiconductor packages
- shielded devices, encapsulated components, complete modules
- integrated circuits with multi-level chipping
- printed electronics, hidden connections
- bare boards, multilayer boards
- power modules
Design features:
- presence of control and indication organs
- protective earthing
- convenient access to the elements involved in the process of operation
- maximum size of the investigated object - 440x550 mm.
- maximum weight of the investigated object - 5 kg.
- power supply from AC 230 V, 50 Hz.
Advantages:
Domestic products, in-house service and spare parts
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