RAM
Option: 4 4GB modules - Transcend TSMTD3LR08-4G; Option: 4GB modules - Transcend TSMTD3LR03-8GL; Option: 4GB modules - Transcend TSMTD3LR05-16G; Option: 4GB modules - Transcend TSMTD3LR05-16G.
External interfaces
3 Ethernet 1000Base-T network ports with RJ45 connectors; 2 Ethernet 100Base-TX network ports with RJ45 connectors from ICC; 2 USB 2.0 peripheral ports with type A connectors; 1 RS-232 console port with DE-9 connector from server; 1 video port with VGA con
Size
244×244 mm PCB, microATX form factor; 244×251×38 mm dimensions including protruding elements
Chipset
1 processor Elbrus-8C1 (1891VM028 - 8 cores, up to 1300 MHz); 1 south bridge KPI-2 (1991VG2Ya)
RAM
4 DDR3-1600 ECC (DIMM 240-pin) slots, up to 64GB
Long-term memory
8 SATA 3.0 ports for HDD and SSD drives
Video system
1 Silicon Motion SM718 embedded controller
Audio system
1 built-in PC Speaker
Internal interfaces
2 USB 2.0 pads with 10-pin connectors for 4 front ports; 1 GPIO pad with 5-pin connector for direct I/O; 2 SPI pads with 8-pin connectors for ROM update; 4 JTAG pads with 10-pin connectors for CPU, KPI, ... diagnostics; 1 FP pad with connector
Internal interfaces of the MDZ
1 slot M.2 USB format for Trusted Boot Module (TMB) - only "APMDZ-I/E" (KBJ.468243.173) is supported; 1 slot Touch Memory to APMDZ; 1 slot Encoder to APMDZ; 1 slot USB to APMDZ; 1 pad IN
Internal ICC interfaces
1 SO-DIMM slot for Server Management Module (SMM) - only "SMM-A" (LYAUI.0469535.149) is supported; 1 RS-232 pad with 10-pin connector for SMM; 1 IPMB connector for SMM controlled devices.
Expansion slots
3 x16 PCI Express 2.0 slots (2×8 + 1×4 or 1×16 + 1×4); 1 PCI 2.3 32-bit 5 volt slot, 33/66 MHz frequency
Power system
1 ATX 24-pin connector for main power input; 1 EPS12V 8-pin connector for auxiliary power input; 1 CR2032 battery connector for storing settings
Cooling system
CPU: 80×80 mm cooler mounting holes (Socket 1366, 2011); KPI: 25×25 ... 40×40 mm heatsink mounting on thermal tape; 5 4-pin connectors for fans (3 PWM, 2 non-reactive).
Operating conditions
Moderately cold climate (UHL), group 1.1 according to GOST 15150, temperature +0...+35 °C, limit temperature -60...+60 °C, humidity up to 80 % at +25 °C without condensation
Panels comprising
1 multilayer PCB - E8C-EATX (LYAUI.687283.044); optional: 1 SuperMicro Rear Port Frame (MCP-260-00078-0N)
Microcircuits comprising
1 central processor - Elbrus-8C1 (1891VM028); 1 peripheral controller - KPI-2 (1991VG2YA); 3 1GbE transceivers - Marvell Alaska Ultra 88E1111; 1 video controller - Silicon Motion SM718GX160000-AB; 1 RS-232 buffer - Texas Instruments MAX3243; 1 module - Tex
Trusted Boot Module
Option: 1 module - Ancad APMDZ-I/E (KBJ.468243.173)
Server Management Module
Option: 1 module - INEUM MUS-A (LYAUI.469535.149)
Power system
Option: 1 3.0 V battery type CR2032
Cooling system
option: 1 plate under CPU - 80×80 mm (LYAUI.753322.003); option: 1 heatsink on KPI - Fischer Elektronik ICK S 36x36x10
Operating temperature range
0...35 million m³