The product is intended for use as the main printed circuit board of a modular electronic device, for example, a server.
The product provides:
Connection of 2 Intel Xeon Scalable Processors with calculated TDP (Thermal Design Power) up to 205W
Mechanical and electrical connection to the processor - Skylake EP LGA3647
Connection up to 24 DIMM DDR4 2666 MHz RAM modules
SATA M.2 hard drive connection
Connection of management subsystem with USB, LAN, SATA interfaces
Connection of up to 8 PCIe x8 interfaces or 4 PCIe x16
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