The microwelding unit is designed for ultrasonic, thermosonic and contact microwelding of gold wire by the method of "ball-and-wedge", "wedge-and-wedge".
The main technological feature of the unit is that thermosonic welding of gold wire on the board by the method of "wedge", as well as "ball" can be carried out with simultaneous superimposition of microcontact welding (if you choose this operation of work on the unit), which allows you to install jumpers - micro welding on the contact pads of the following materials: on which there may be organic contaminants (for example: flux residues after maintenance), on immersion gold, on printed circuit boards, on aluminium, on nickel, on the contact pads of the following materials: on which there may be organic contaminants (for example: flux residues after maintenance), on immersion gold, on printed circuit boards, on aluminium, on nickel, on the contact pads of the following materials.
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